Capability Roadmap
 
Feature
Base Material CEM3,
Middle-Tg FR4,
High-Tg FR4,
Halogen free,
High speed / low loss,
BT / Rogers / PTFE
Max. Layer Count 18
Max. PCB Size (max.) 558mm X 660mm
Base copper 1/3 - 4 OZ
Copper thickness (outer) 5 OZ
Max. Board Thickness mm (mil) 3.4 (134)
Min. Board Thickness mm (mil) 0.1 (4)
Min. Line Width / Spacing Inner um (mil) 75/75 (3/3)
Outer um (mil) 75/75 (3/3)
Min. Mechanical Drill Size (mm) 0.15
Min. HWTC um (mil) 175 (7)
Min. Soldermask Opening um (mil) 50 (2)
Finest SMT Pitch mm (mil) 0.40 (16)
BGA Device Pitch (Base Copper 1oz) (mil) 0.25-0.3 (10-12)
Type of Surface Finish HASL, lead free HASL, ENIG, Flash gold,Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver
Impedance Control +/- 8%
Warpage 0.50%