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| Feature |
| Base Material |
CEM3,
Middle-Tg FR4,
High-Tg FR4,
Halogen free,
High speed / low loss,
BT / Rogers / PTFE |
| Max. Layer Count |
18 |
| Max. PCB Size (max.) |
558mm X 660mm |
| Base copper |
1/3 - 4 OZ |
| Copper thickness (outer) |
5 OZ |
| Max. Board Thickness mm (mil) |
3.4 (134) |
| Min. Board Thickness mm (mil) |
0.1 (4) |
| Min. Line Width / Spacing |
Inner um (mil) |
75/75 (3/3) |
| Outer um (mil) |
75/75 (3/3) |
| Min. Mechanical Drill Size (mm) |
0.15 |
| Min. HWTC um (mil) |
175 (7) |
| Min. Soldermask Opening um (mil) |
50 (2) |
| Finest SMT Pitch mm (mil) |
0.40 (16) |
| BGA Device Pitch (Base Copper 1oz) (mil) |
0.25-0.3 (10-12) |
| Type of Surface Finish |
HASL, lead free HASL, ENIG, Flash gold,Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver |
| Impedance Control |
+/- 8% |
| Warpage |
0.50% |
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